EFEM Solution for 3-D Stacking Device Process
(Semiconductor Manufacturing Process using Tape Frame)
Tape Frame Wafer EFEM
High reliability, well experienced EFEM
for 300mm wafer is working in the front-end process in all over the world
SEMI Standard conformity
Supporting various type of Tape Frame FOUP
*Please contact for detail
Particle Free
- ・Wafer Invert Function
- ・Area sensor
- ・E84 Interface
- ・Ionizer
- ・N2 Purge Function for Load Port
