Vacuum-less wafer handling
(clean class 1)

restrains particles from adhering on a wafer back

Smooth wafer handling with minimum vibration (1.47m/sec²)

is realized by introducing High-density linear pulse motor to the traveling axis drive

Small foot-print
(minimum swinging envelop : 245mm)

is realized by minimizing swinging envelop of a handling robot with our abundant compact design capability

Auto-calibration capacity (option)

makes our robot free from re-teaching on maintenance

High speed and accurate wafer handling(±0.05mm)

is realized by employment of SHINKO original wafer handling robot and traveling method

Application to 200mm wafer and quartz wafer (option)

is supported by actual supply reference