Semiconductor Equipment
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300mm N2 EFEMnew
Ability to perform cutting edge processes
by regulating Ox/H2O levels within the EFEM.
Features
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1Extremely Low Level Oxygen Control
Less than 100ppm with low N2 Gas Consumption (150LPM) by N2 Gas Circulation System
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2Fine Differential Pressure Automatic Control
10 Pa Gauge +/- 3.5
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3Equivalent Footprint as Conventional EFEM
With the stationary type robot, maximum 4 LP access is possible : No need to change depth of N2EFEM
Maintenance access from side as Conventional EFEM
(Or can use EFEM Side Position for Additional Options)
Flexible Layout for Position of Customer L/L -
4EFEM Inside Environment Monitor/Analyzing
Using digital analyzers
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5Safe Operation
Safely replace N2 gas to Air
S2, S8, CE Compliance