Semiconductor Equipment
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Contribution to Next Generation Technology
(SEMICONDUCTOR Miniaturization to 12nm,7/8nm)N2 purge
300mm FOUP Load Portnew
(Smart SELOP-7-N series)Prevent cross contamination and surface oxidationQuickly control wafer in FOUP through Loadport N2 purge function
Features
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1N2 purging on Carrier Base
Adapted FOUP Type: ENTEGRIS A-300, Spectra
(4 Purge Port Type) #1 -
2Preventing contamination through purge port
- GAS-Filter at INLET Port side #2
- Adhesion to Grommet of FOUP-side
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3Monitor N2 Gas flow rate by flow meter
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4Control N2 Gas flow rate by MFC
#1 N2 purging on Carrier Base
#2 GAS-Filter at INLET Port side
Superior Stable N2 Purge by Original movable nozzle
- Control nozzle up/down timingAvoid interference to Kinematic Pin during FOUP placement
Interoperatability of non-N2 purge FOUP - Adjustment function of nozzle pressure
- Exchangeable nozzle heads for Suitable attach to ports
- Nozzle up / down position detect function (Sensor)