Semiconductor Equipment

  • Contribution to Next Generation Technology
    (SEMICONDUCTOR Miniaturization to 12nm,7/8nm)

    N2 purge
    300mm FOUP Load Portnew
    (Smart SELOP-7-N series)

    Prevent cross contamination and surface oxidationQuickly control wafer in FOUP through Loadport N2 purge function

Features

  • 1N2 purging on Carrier Base

    Adapted FOUP Type: ENTEGRIS A-300, Spectra
    (4 Purge Port Type) #1

  • 2Preventing contamination through purge port

    • GAS-Filter at INLET Port side #2
    • Adhesion to Grommet of FOUP-side
  • 3Monitor N2 Gas flow rate by flow meter

  • 4Control N2 Gas flow rate by MFC

#1 N2 purging on Carrier Base

#2 GAS-Filter at INLET Port side

Superior Stable N2 Purge by Original movable nozzle
  • Control nozzle up/down timingAvoid interference to Kinematic Pin during FOUP placement
    Interoperatability of non-N2 purge FOUP
  • Adjustment function of nozzle pressure
  • Exchangeable nozzle heads for Suitable attach to ports
  • Nozzle up / down position detect function (Sensor)